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Job Description Our company actively drives technological innovation in semiconductor back-end processes, with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP). In rapidly growing fields—including AI, high-performance computing (HPC), automotive, and IoT—there
This role requires the candidate to work on-site in Tokyo, Japan. Client Overview Our client is a global technology company delivering advanced digital transformation, artificial intelligence, cloud computing, and software engineering solutions to enterprise clients across
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