Wafer Bonding Equipment Staff Engineer

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking. Our work culture values diversity, social responsibility, open communication, mutual trust and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates.

Skyworks is seeking a highly skilled and experienced equipment engineer for wafer bonding. As a key member of our engineering team, you will be responsible for operation, maintenance and enhancements of equipment cluster used for fusion bonding in a new manufacturing line. You will work closely with the technology development and operations departments to qualify, document and ensure the stability, reliability and effectiveness of the equipment throughout development phase and high-volume manufacturing.

The Wafer Bonding Equipment Engineer will be part of the SAW Technology Development team and plays a pivotal role in the industrialization of a new manufacturing line. The position is located in Osaka.

Job Description

The job will involve the following functions:

• Operate and maintain wafer bonding equipment to ensure optimal performance, resolve equipment issues, minimizing downtime.
• Manage daily/weekly planned and unplanned maintenance of the bonding cluster.
• Handling excursions, driving corrective and continuous improvement actions.
• Create and improve maintenance plans and procedures.
• Work cross-functionally to define integration requirements and establish best practices according to product requirement.
• Evaluate new equipment and stay updated on industry innovations and state-of-the-art techniques.
• Collaborate with R&D teams to transition from concept to high-volume manufacturing.

Education, Experience, and Skills

• Bachelor/Master’s Degree in Electrical Engineering, Mechatronics, Industrial Automation, Physics, Mechanics or related field.
• Minimum of 6 years of experience in equipment engineering, with 4 years in fusion bonding field.
• Expert level understanding of wafer bonding equipment.
• Knowledge in the use of Design of Experiments, statistical process control and analysis tools.
• Experience in creating, documenting and maintaining work instructions.
• Strong analytical and problem-solving skills, both technical and interpersonal.
• Pragmatic and flexible attitude with a result- and data-driven can-do mentality.
• Works autonomously, well-organized, with a good attention to detail, while setting high standards in all aspects of the work.
• Excellent communication skills, professional level of written and verbal communication in English.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. #LI-IT1