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Our team members are at the heart of everything we do. At Cencora, we are united in our responsibility to create healthier futures, and every person here is essential to us being able to deliver on
Job Details: Job Description: The Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD: S and WA) team develops and delivers advanced substrate packaging and wafer assembly solutions for customers. As part of the Substrate Technology
ー Quality engineering, test automation, CI/CD validation, and operational documentation for retail robotics operations As a Product Quality Engineer for Robotics Applications, you will improve the release quality, reliability, and usability of software used in real