Job Description Our company actively drives technological innovation in semiconductor back-end processes, with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP). In rapidly growing fields—including AI, high-performance computing (HPC), automotive,
Location(s) Kanoya, Kagoshima Company Molex Career Field Engineering Job Number 187842 Your Job Process Engineer (Equipment & Process Development) Our Team As a Process Engineer in the Manufacturing Engineering (ME) organization, you will be involved in
Location(s) Kanoya, Kagoshima Company Molex Career Field Engineering Job Number 187848 Your Job Mold Design and Development Engineer / 金型設計・開発エンジニア Our Team You will play an active role as a precision injection mold design engineer in