Be the product package solution project leader from Package Innovation R&D team to develop the package solution for Mobile, Secure Communications, Wireless Connectivity, Power, IoT and Radar applications. This position is responsible for leading the packaging projects
Job Details: Job Description: Supports management/senior leadership to incorporate process and quality improvements in Intels supply chain strategy. Defines material inspection methodology, conducts studies related to cost control, process control, and production yield, and implements plans
Job Details: Job Description: We are seeking a highly motivated engineer to support the METI-SATAS program, focused on development, integration, and deployment of next-generation assembly and test process equipment, factory automation systems, and material handling solutions
Job Details: Job Description: The Custom ASIC Sales account manager (SAMs) are part of a global team of expert custom silicon and ASIC sales specialists focused on identifying, shaping, and winning custom opportunities with our largest
Job Details: Job Description: The Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD: S and WA) team develops and delivers advanced substrate packaging and wafer assembly solutions for customers. As part of the Substrate Technology Integration Group,