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Semiconductor Packagingの求人-杉並 - 10 Job Positions Available

10 / 1 - 9 求人
NXP Semiconductors 求人

Be the product package solution project leader from Package Innovation R&D team to develop the package solution for Mobile, Secure Communications, Wireless Connectivity, Power, IoT and Radar applications. This position is responsible for leading the packaging projects

NXP Semiconductors  13日前
KLA 求人

Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR

KLA  28日前
KLA 求人

Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR

KLA  28日前
Intel 求人

Job Details: Job Description: Supports management/senior leadership to incorporate process and quality improvements in Intels supply chain strategy. Defines material inspection methodology, conducts studies related to cost control, process control, and production yield, and implements plans

Intel  28日前
Henkel 求人

このポジションについて 職務内容 Conduct field visits to customers to understand application requirements, usage habits, and competitive landscape Provide technical support including product recommendations, application demonstrations, and on-site troubleshooting Develop and implement adhesive solutions using application equipment to

Henkel  26日前
KLA 求人

Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR

KLA  12日前
Intel 求人

Job Details: Job Description: We are seeking a highly motivated engineer to support the METI-SATAS program, focused on development, integration, and deployment of next-generation assembly and test process equipment, factory automation systems, and material handling solutions

Intel  10日前
Intel 求人

Job Details: Job Description: The Custom ASIC Sales account manager (SAMs) are part of a global team of expert custom silicon and ASIC sales specialists focused on identifying, shaping, and winning custom opportunities with our largest

Intel  10日前
Intel 求人

Job Details: Job Description: The Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD: S and WA) team develops and delivers advanced substrate packaging and wafer assembly solutions for customers. As part of the Substrate Technology Integration Group,

Intel  4日前

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semiconductor packaging 求人 全国 杉並

次も興味があるかもしれません:

Wafer

Sales and Marketing

Japanese

Foundries

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