Job Description Our company actively drives technological innovation in semiconductor back-end processes, with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP). In rapidly growing fields—including AI, high-performance computing (HPC), automotive,
Job Title:Lead, Automation & Controls Engineer Job Description: THE ROLE We are seeking a Lead, Automation and Controls Engineer to drive the design, development, and optimization of advanced automation systems across our manufacturing site in Yonezawa, Japan,