We support peace and prosperity by building connections, understanding and trust between people in the UK and countries worldwide. For 90 years we have shaped brighter futures through education, arts, culture, language, and creativity. Working with
・出荷製品の梱包・開梱作業 ・フォークリフトを使用した荷役・運搬作業 ・完成品の出荷前検査 ・不良品の選別・処理作業 ・製品打刻作業 ・その他、付随する軽作業 - Packing and unpacking of products for shipment - Forklift operation for loading, unloading, and material handling - Final inspection of finished products prior to shipment - Sorting and processing
Job Description: 神戸空港事業所において、ヘリコプターおよびその装備品の整備、修理、新規組立、改造などの各プロセスにおける塗装業務全般を担当します。社内規程、航空法、作業安全基準、および航空機メンテナンスマニュアルを遵守し、品質の高い塗装を実現するとともに、継続的な品質向上と安全な作業環境の維持に貢献していただきます。また、将来のリーダー候補として、チームの技術向上やプロセス改善にも関わっていただきます。 Responsible for all aspects of painting work throughout the processes of maintenance, repair, assembly, and modification for helicopters and their components at the Kobe Airport Facility. The successful candidate will ensure the highest
WHAT IS BOX? Box (NYSE:BOX) is the leader in Intelligent Content Management. Our platform enables organizations to fuel collaboration, manage the entire content lifecycle, secure critical content, and transform business workflows with enterprise AI. We help
Position Duties: Amentum is currently seeking a Hazardous Waste Technician for the Hazardous Materials Minimization Center (HMMC) Okinawa. Under a United States Marine Corps Installation Pacific (USMC-MCIPAC) contract, HMMC provides hazardous material and hazardous waste support
Amentum is currently seeking a Warehouse Specialist for the Hazardous Materials Minimization Center (HMMC) Okinawa. This position may have a rotating shift and may be subject to shift changes, weekend, holiday and overtime work, with proper
Company Description Shaping the Future of Automotive Engineering Applus+ IDIADA is a global leader in automotive engineering, offering a dynamic and rewarding career opportunity for professionals passionate about shaping the future of mobility. As a TOP
Job Description Our company actively drives technological innovation in semiconductor back-end processes, with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP). In rapidly growing fields—including AI, high-performance computing (HPC), automotive,