Location(s): Japan City/Cities: Shiga Travel Required: Relocation Provided: Job Posting End Date: August 14, 2024 Shift: Job Description Summary: Job Description Responsible for performing the following duties under the direction of the Engineering Manager and Maintenance
Requisition Number: 18312 Required Travel: 11 - 25% Employment Type: Full Time/Hourly/Non-Exempt Security Clearance: Ability to Obtain Level of Experience: Mid Meet HII’s Mission Technologies Division Our team of more than 7,000 professionals worldwide delivers all-domain
At EY, you’ll have the chance to build a career as unique as you are, with the global scale, support, inclusive culture and technology to become the best version of you. And we’re counting on your
Key Responsibilities Performs standard Tier I procedures including wafer measurement. Performs preventative maintenance and wet cleans independently. Assists senior engineers with corrective maintenance as needed. Disassembles, cleans and rebuilds kits as part of kit management quality. Learns and applies
