Company Description There is strong requirement for multi functionality and high performance in automotive SoC, such as CASE, which make SoC larger and more complex. As the result, in Renesas, R-Car series is the SoCs which
Company Description Automotive SoC products are key components for realizing the computerization and high functionality of automobiles, as represented by CASE. In addition to the need for higher speed and lower power consumption in the basic
Company Description LSI scale is becoming larger and complex, since high performance SOC requires enhanced function and performance. DFT development requires agile action to meet both test cost and quality. This recruitment is for a inovative
Company Description Automotive SoC products are key components for realizing the computerization and high functionality of automobiles, as represented by CASE. In addition to the need for higher speed and lower power consumption in the basic
Company Description SoC products for automotive applications are key parts for realizing the digitization and higher functionality of automobiles, and their evolution is unstoppable. In recent years, higher performance and higher functionality have been realized, and
Company Description SoC products for automotive applications are key components for the realization of electronic and advanced functions in automobiles, and their development is unabated. However, as a result of higher performance and functionality than ever
Company Description SoC development requires advanced design and verification technologies. In particular, verification technology plays an important role in confirming the performance and quality of the SoC. H/W emulator is a dedicated hardware to simulate SoC
Organization & Role Job Title: Hardware engineer Organization: Device Interface Solutions Group 職種： ハードウェアエンジニア 組織上のグループ： デバイス・インターフェイス・ソリューション・グループ Responsibilities Deliver products to customers on time with hardware that meets customer specifications Provide support for circuit design and board design
Job Description Semiconductor package design and technology development work. In order to achieve the best possible characteristics, cost, and quality for semiconductor chips, we design the best possible package shape, materials, and processes. We will work
Job Description Work within the analog design team for new product development; Work closely with digital, layout & AMS teams with chip implementation Participate in IPD, GDU Analog product lines, including blocks such as LDOs, Bandgaps,
Key Responsibilities: Performs all standard service activities through Tier I with assistance. Able to perform routine preventative maintenance within established timeframes. Responds to fab issues by communicating with other engineers. Verifies operational quality of system equipment
Work Flexibility: Hybrid or Onsite Position summary: Work as part of the Network Services Integration team to deliver network infrastructure projects in line with identified requirements. Work with key stakeholders to ensure that all deliverables are
About BHP: At BHP we support our people to grow, learn, develop their skills and reach their potential. With a global portfolio of operations, we offer a diverse and inclusive environment with extraordinary career opportunities. Our
Requisition #: 14327 Internal Job Title: Technical Support Engineer Job Level: P1 Hiring Mgr: Yuichiro Hiyoshi External Job Title: Technical Support Engineer : Electromagnetics Business Unit: ANSYS Customer Excellence Recruiter: Masamichi Tanaka Our Mission: Powering Innovation
Key Responsibilities: Performs all standard service activities through Tier0 & Tier I with assistance. Able to perform routine preventative maintenance within established timeframes. Responds to fab issues by communicating with other engineers. Verifies operational quality of
Key Responsibilities: Performs all standard service activities through Tier0 & Tier I with assistance. Able to perform routine preventative maintenance within established timeframes. Responds to fab issues by communicating with other engineers. Verifies operational quality of
Key Responsibilities: Performs all standard service activities through Tier0 & Tier I unassisted. Performs standard Tier II with assistance. Able to perform routine preventative maintenance within established timeframes. Completes quality repairs. Responds to fab issues by
Key Responsibilities: Performs all standard service activities through Tier0 & Tier I with assistance. Able to perform routine preventative maintenance within established timeframes. Responds to fab issues by communicating with other engineers. Verifies operational quality of
Company Description The demand for custom chips has surged in recent years, particularly in fields such as AI (Artificial Intelligence), machine learning, and big data processing and customers are seeking more efficient and high-performance custom solutions.
Company Description The demand for custom chips has surged in recent years, particularly in fields such as AI (Artificial Intelligence), machine learning, and big data processing and customers are seeking more efficient and high-performance custom solutions.
