Job Description Semiconductor package design and technology development work. In order to achieve the best possible characteristics, cost, and quality for semiconductor chips, we design the best possible package shape, materials, and processes. We will work
Company Description Renesas has W/W No1 share in automotive MCU. In order to keep No1 share and to be more strong in W/W, need to enhance our ability of backend desing for performance, low power, squeezing
Company Description High performance SoC are key parts to realize automobiles electric and high performance which are so called CASE (Connected, Automated, Shared, Electric). SoC are becoming more larger and complex to meet the demand of
Company Description High performance SoC are key parts to realize automobiles electric and high performance which are so called CASE (Connected, Automated, Shared, Electric). SoC are becoming more larger and complex to meet the demand of
Company Description LSI scale is becoming larger and complex, since high performance SOC requires enhanced function and performance. DFT development requires agile action to meet both test cost and quality. This recruitment is for a inovative
Company Description Wafer prices for advanced processes are high, and the cost impact of manufacturing yield is very large. To improve yield, it is important to investigate the root causes of failures and improve manufacturing processes