Company Description Wafer prices for advanced processes are high, and the cost impact of manufacturing yield is very large. To improve yield, it is important to investigate the root causes of failures and improve manufacturing processes
Job Description Semiconductor package design and technology development work. In order to achieve the best possible characteristics, cost, and quality for semiconductor chips, we design the best possible package shape, materials, and processes. We will work
Company Description Renesas keeps No.1 position in worldwide Automotive MCU market since long time, and aims to grow more for the future as a solid ground of Renesas business. We Automotive MCU Marketing team play a
Company Description Renesas has W/W No1 share in automotive MCU. In order to keep No1 share and to be more strong in W/W, need to enhance our ability of backend desing for performance, low power, squeezing
Company Description High performance SoC are key parts to realize automobiles electric and high performance which are so called CASE (Connected, Automated, Shared, Electric). SoC are becoming more larger and complex to meet the demand of
Company Description LSI scale is becoming larger and complex, since high performance SOC requires enhanced function and performance. DFT development requires agile action to meet both test cost and quality. This recruitment is for a inovative
Job Description Work within the analog design team for new product development; Work closely with digital, layout & AMS teams with chip implementation Participate in IPD, GDU Analog product lines, including blocks such as LDOs, Bandgaps,
Job Description Act as global team member of product marketing for High-Performance MCU Tools and Infrastructure Collection, definition, and close follow-up on Global customer requirements Develop and drive solution strategy (e.g., ecosystem for each market segment/