企業概要 At WD, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. At our core, WD is a company of problem solvers. People
Job Description Our company actively drives technological innovation in semiconductor back-end processes, with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP). In rapidly growing fields—including AI, high-performance computing (HPC), automotive,
Job Title:Equipment Engineer Job Description: The Role: Design, procure, implement, and validate advanced automation and capital equipment to unlock Develop new automated equipment by coordinating its design, purchase, or construction, ensuring manufacturability, reliability, and lifecycle cost
このポジションについて The Production Manager for Hotmelt Operation oversees all manufacturing activities related to hotmelt adhesive processes, ensuring efficient production flow, product quality, and safety compliance. 職務内容 Production Management Manage daily hotmelt production operations to meet output
企業概要 Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced
Job Title:Equipment Engineer, Manufacturing Engineering Job Description: The Role: As the Manufacturing Engineer main objective will be the design, procurement, implementation, and validation of automation and capital equipment. Develop new equipment, coordinate its design, purchase or
Location(s) Kanoya, Kagoshima Company Molex Career Field Engineering Job Number 187842 Your Job Process Engineer (Equipment & Process Development) Our Team As a Process Engineer in the Manufacturing Engineering (ME) organization, you will be involved in
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers