Job Details: Job Description: The Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD: S and WA) team develops and delivers advanced substrate packaging and wafer assembly solutions for customers. As part of the Substrate Technology
ー Quality engineering, test automation, CI/CD validation, and operational documentation for retail robotics operations As a Product Quality Engineer for Robotics Applications, you will improve the release quality, reliability, and usability of software used in real
Appealing Points: Drive SAP Master Data Excellence – Manage SAP master data, governance, migration, and integration across MM, SD, and FI modules to ensure data quality and consistency. Own End-to-End SAP Testing – Lead test planning,
Appealing Points: Lead large-scale enterprise transformation programs by managing end-to-end testing for infrastructure carve-outs, cloud migrations, and application transitions across APAC. Drive quality across complex IT landscapes by overseeing testing for Oracle, SAP, enterprise applications, cloud
Civils QA Site Inspector Location: Tokyo Type: 3month FTC contract Rates: (Apply online only) per day, paid in arrears (weekly timesheets) Start Date: 1st September 2026 Project Partners are now recruiting for an experienced Civils QA
Appealing Points: Work with Enterprise SAP Master Data: Manage and optimise critical SAP master data (Material, Vendor, Customer, BOM) while ensuring data quality, governance, and seamless integration across MM, SD, and FI modules. End-to-End SAP Testing
