Join our Team About us Ericsson is opening a state‑of‑the‑art R&D center in Yokohama focused on Radio and Software development. This new hub will support leading Japanese CSPs, partner with local vendors and deliver Japan‑driven products
Job Description 【募集背景】 ルネサスは、産業機器およびフィジカルAI向けSoC製品の開発をグローバルに推進しています。近年、ロボティクス、マシンビジョン、自律制御システムなどの分野では、高度な画像認識やAI処理性能への要求が高まっており、先端プロセスを用いた大規模SoCの開発が加速しています。 これらの製品開発において、競合に対するコスト競争力と技術優位性を確保するためには、開発初期段階からシステムレベルで実現性を検証し、SoC、Package、PCBを含めたシステム全体の最適化を進めることが重要です。 そのため、装置・システム全体を理解した上で、SoC、Package、PCB間の要求を整理し、PCBとPackageの協調設計をリードできる専門人材が必要です。グローバルな開発チームや各分野の専門家と連携しながら、次世代フィジカルAI向けSoCのシステム実現性を早期に確保し、性能とコスト競争力の最大化を推進するPCB / Package Design Engineerを募集します。 【職務内容】 ・産業機器およびフィジカルAI向けSoC製品のPCB設計およびPackage設計 ・DDR4、DDR5、LPDDR4、LPDDR5などの高速Memory Interfaceを搭載するSoC製品のPCB / Package実現性検討および設計 ・PCI Express、USB 3.x、Ethernet PHYなどの高速Interface / SerDesを搭載するSoC製品のPCB / Package実現性検討および設計 ・LPDDR6を搭載する次世代SoC製品のPCB / Package実現性検討 ・多ピンFCBGA、Wire Bond BGAからQFN、WLCSPまで、幅広いPackageの基板設計・再配線(RDL)設計、および電気特性・EMC検証 ・SoC製品のPCB電源設計、およびSignal Integrity(SI)/ Power Integrity(PI)の解析・検証 ・SoC HW設計チーム、Validationチームをはじめとするグローバルな開発チームとの協業、およびSoC / Package / PCB協調設計の推進 Qualifications 【必須要件】 ・Cadence設計ツールを用いたPCBおよびPackage設計の実務経験 ・PCB / Package設計データから、Ansysなどの電磁界解析ツールを用いたSパラメータおよびRLCパラメータの抽出・解析経験 ・抽出したSパラメータおよびRLCパラメータを用いた、SPICEなどの回路シミュレーションによるSignal
About the job Mercor connects elite creative and technical talent with leading AI research labs. Headquartered in San Francisco, our investors include Benchmark, General Catalyst, Peter Thiel, Adam DAngelo, Larry Summers, and Jack Dorsey. Position: CAD
Valeo is a tech global company, designing breakthrough solutions to reinvent the mobility. We are an automotive supplier partner to automakers and new mobility actors worldwide. Our vision? Invent a greener and more secured mobility, thanks
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Job Description: About Organization Cloud Platform Department has the mission provisioning Rakuten Mobiles virtualized Cloud infrastructure. Especially, Cloud Infrastructure Section is responsible for designing, developing, deploying and supporting operation of hardware platform for core datacenter of
To make electronics, you need chips, wafers, transistors, reticles, and. To make these, you must see, test and manufacture them at scale—faster and better than ever before. Thats where KLA comes in. Whether youre early in
About the job Mercor connects elite creative and technical talent with leading AI research labs. Headquartered in San Francisco, our investors include Benchmark, General Catalyst, Peter Thiel, Adam DAngelo, Larry Summers, and Jack Dorsey. Position: CAD
Job Description • Develop necessary hardware and software to enable comprehensive silicon device evaluation: PCB schematic and layout design, automation software • Conduct power IC evaluations and debugging on chip and board level • Create technical documents (datasheet,
Job Description 1. Package Development & NPI Support - Support package development activities for new Power MOSFET products including: TOLL / TOLG / TOLT Bottom-side cooled (BSC) Dual-side cooled