Job Details: Job Description: The Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD: S and WA) team develops and delivers advanced substrate packaging and wafer assembly solutions for customers. As part of the Substrate Technology
About Us: MKS/ESI is a leading innovator in the PCB industry, providing cutting-edge laser drill systems that enhance manufacturing efficiency and precision. We are dedicated to delivering top-quality solutions and exceptional customer service. ESI Japan KK is
Primary Duties & Responsibilities Responsible for Field Service Engineer Lead and manage with key customer in semiconductor business and overseas factory Education & Experience Graduate in engineering, electrical, physics, etc. from a university of science and technology