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Job Details: Job Description: The Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD: S and WA) team develops and delivers advanced substrate packaging and wafer assembly solutions for customers. As part of the Substrate Technology
Primary Duties & Responsibilities Responsible for Field Service Engineer Lead and manage with key customer in semiconductor business and overseas factory Education & Experience Graduate in engineering, electrical, physics, etc. from a university of science and technology
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