Job Description Our company actively drives technological innovation in semiconductor back-end processes, with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP). In rapidly growing fields—including AI, high-performance computing (HPC), automotive,
Job Title:Equipment Engineer, Manufacturing Engineering Job Description: The Role: As the Manufacturing Engineer main objective will be the design, procurement, implementation, and validation of automation and capital equipment. Develop new equipment, coordinate its design, purchase or