Job Description Position Overview The GaN Layout Tape-Out Support Engineer is responsible for end-to-end tape-out execution for Gallium Nitride (GaN) technologies. This role supports multiple concurrent tape-out flows, ensuring accurate, high-quality mask data delivery while enabling
Job Description Systems (80% - 90%): - Leverage strong technical knowledge of our existing high-side switches portfolio, deep understanding of the technologies, standards and protocols within an industry or end equipment, and an ability to engage
Job Description We are looking for an experienced validation engineer to join our team. The role focuses on technical leading of UX audit/validation for our MCU, MPU and Power product. This is a great opportunity to
Job Description 【Background of the Recruitment】 The Power Product group at Renesas is a core part of the company’s vision to deliver safe, smart, and sustainable solutions for automotive, industrial, infrastructure, and IoT markets. Renesas aims
Job Description Systems (80% - 90% is the range of the job responsibility): - Leverage strong technical knowledge of our existing high-side switches portfolio, deep understanding of the technologies, standards and protocols within an industry or
Job Description We are looking for an experienced validation engineer to join our team. The role focuses on technical leading of UX audit/validation for our MCU, MPU and Power product. This is a great opportunity to
Job Description 自動運転の進化を実現するためには、自動車に搭載されるコンピューティング性能の飛躍的な向上が求められており、その中核を担う車載SoCの高性能化は、最も重要な要素の一つと位置づけられています。 こうしたニーズを背景に、R-Carシリーズには、高密度な演算性能に加え、高性能カメラや高速インターフェースなどの多様なIPを統合することが求められています。これを実現するため、従来の単体デバイスのさらなる高性能化に加え、ChipletやSiPといった先端パッケージ技術を活用したアプローチを推進しています。 これらの開発においては、SoCダイ、パッケージ、さらにはシステムボードまでを含めた統合的な設計が不可欠となります。 そこで当部門では、パッケージ設計技術の強化を目的として、パッケージおよび関連技術の開発をリードする人材を募集しています。半導体アーキテクチャ設計からレイアウト設計、ボード設計までを関係部門と連携しながら、先端パッケージの設計・開発を担っていただきます。 【開発対象】 ・FCBGAパッケージ ・先端パッケージ、2.5Dパッケージなど ・SOC搭載ボード ・半導体レイアウトのバンプ周辺部 【職務内容】 ・FCBGAパッケージ設計 ・要素技術開発 ・FCBGAパッケージ搭載ボード設計 ・SI/PIシミュレーション ・構造シミュレーション ・チップレットを用いたデバイス・システムモジュールのアーキテクチャ設計および概要設計 ・インタフェース／電源要件を満たすインターポーザ設計のリーディング ・設計担当エンジニアとの技術的調整および設計レビュー Qualifications ・半導体パッケージ若しくはボード基板設計経験 ・通信インターフェース若しくはDRAMインターフェース回路設計経験 ・SI/PI検証経験 ・英語による技術的な打ち合わせや仕様確認に抵抗がないこと ・チップレット設計経験 ・パッケージ構造設計・検証経験 ・ボードレベルの回路設計経験 ・電源設計経験 To enable the continued evolution of automated
Job Description 【Background】 This team support SPS FET design for PCP. In the last year, two out of the four device engineers who no longer with the company. We are aslo supporting the new MV FET
Job Description Position Overview The GaN Layout Tape-Out Support Engineer is responsible for end-to-end tape-out execution for Gallium Nitride (GaN) technologies. This role supports multiple concurrent tape-out flows, ensuring accurate, high-quality mask data delivery while enabling
Job Description Executive Summary The Chief of Staff serves as the primary leadership partner to the Head of HWJP and plays a key role in improving how HWJP operates. This role strengthens transparency, governance, decision readiness,
Job Description 【Background of the Recruitment】 The Power Product group at Renesas is a core part of the company’s vision to deliver safe, smart, and sustainable solutions for automotive, industrial, infrastructure, and IoT markets. Renesas aims
Job Description We are seeking a highly motivated GaN Technology Development Engineer to lead development of next-generation GaN power devices. This role focuses on unit process development, process integration, and wafer-level electrical characterization, driving technology from
Job Description 【Role Overview】 The Chief of Staff is a senior leadership partner focused on improving organizational effectiveness, transparency, information flow, execution discipline, and decision readiness across HMDD. Transparency is a foundational principle of HMDD. The
Job Description As a Staff Application Engineer in our Technical Marketing team, you will work in a global environment providing support and comprehensive technical information to our customers, internal teams and businesses partners. The technical focus
Job Description Looking for an experienced engineer which Roles and Responsibilities: (1) System / design architecture, Development of middleware frameworks, and understand about device drivers for ADAS/AD, Gateway, Cockpit/IVI that bring out the potential of Renesas
Job Description Renesas Electronics Corporation is seeking a dynamic and strategic leader for the role of HRBP, Regional HR Strategy. The successful candidate will serve as a Strategic HR Business Partner, supporting key business leaders across
Job Description Experience in electronic control development using MCUs (hardware and/or software), or experience working with customers or applications in the automotive industry. Strong analytical and problem-solving skills to identify and resolve technical issues. Good communication skills with
Job Description 【Reason for Hiring】 High performance SoC are key parts to realize automobiles electric and high performance which are so called CASE (Connected, Automated, Shared, Electric). SoC are becoming more larger and complex to meet