Performs electrical or mechanical troubleshooting to determine problems in non-functioning electro-mechanical equipment used in the manufacturing process. Dismantles, adjusts, repairs and assembles equipment according to layout plans, blueprints, operating or repair manuals, rough sketches or drawings.
Be the product package solution project leader from Package Innovation R&D team to develop the package solution for Mobile, Secure Communications, Wireless Connectivity, Power, IoT and Radar applications. This position is responsible for leading the packaging
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
求人内容 【募集背景】 AIデータセンターの急速な拡大に伴い、半導体デバイスの需要が大きく増加しています。 当社ではこれを受け、生産能力拡大に向けた大規模な投資を実施しています。 今後、早期の売上拡大に貢献するため、複数の生産関連プロジェクトを確実かつ効率的に推進する必要があります。 本ポジションでは、これらのプロジェクトの運営強化を目的として、全体を俯瞰して推進できる人材を募集します。 半導体の開発および生産に関する知見を活かし、関係部門を横断してプロジェクトをリードできる方を求めています。 【職務内容】 職務内容: 内製工場への新規技術導入の企画立案及びプロジェクト全体を俯瞰し、計画から実行まで一貫してリードする役割を担う 担当業務： ①新製品/新技術立上プロジェクトの計画立案、推進、進捗管理、関係部門との調整をおこなう。 ②生産部門、事業部門、技術開発部門と連携し、内製工場への新技術導入戦略の策定 (投資費用、開発費用、開発期間、必要リソース、サプライチェーン等を含む) 【Reason for Hiring】 The rapid expansion of AI data centers is significantly increasing demand for semiconductor devices. To respond to this growth,
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen,
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen,
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen,
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen,
Job Description [Hiring Background] Reneas has set a goal of achieving over USD 20 billion in revenue by 2035 and will continue to expand the possibilities of advanced semiconductor solutions. Building on this vision, our division
企業概要 Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced
Job Title:Lead Fab Technology Engineer, Surface Preparation and Integration Job Description: Entegris is seeking a Lead Fab Technology Engineer for Surface Preparation and Integration (SPI) based in Japan to play a pivotal role in solving our
Job Description AIの急速な普及に伴い、データセンターおよびAIサーバーの高性能化と省電力化が重要なテーマとなっています。GPUやアクセラレータの進化により消費電力は増大しており、それを支える電源システムには高効率・高信頼性が求められています。この中核を担うのがPower MOSFETなどのパワー半導体です。 私たちのチームでは、AIサーバー用途に向けた20～100VクラスのPower MOSFETの開発に取り組んでおり，レイアウト設計やTCADを用いた素子構造設計により、デバイス特性の最適化を進めています。 本インターンシップでは、Power MOSFETの設計業務に携わり、レイアウト設計やTCADによる素子設計を体験していただきます。加えて、前工程試作ロットの管理や特性データの整理・解析、結果のまとめにも取り組みます。これらを通じて、設計とデバイス特性の関係を理解できます。 研究室での知識を実際の製品開発に活かせる機会であり、現場エンジニアとの議論を通じて理解を深めることができます。業務は主に日本語で行いますが、海外チームと連携するため英語でのコミュニケーション機会もあります。 （変更の範囲：会社の定める場所） With the rapid expansion of AI technologies, improving the performance and energy efficiency of data centers and AI servers has become increasingly important. The growing power
Responsibilities（Immediately after hiring) 1. Pre-check FCCB report 2. Summarize quality related KPI and report preparation 3. Assist engineers to summarize FCCB, SPC, Audit related KPI Minimum Qualifications 1. Ability to use excel for data summarization 2.
Responsibilities （Immediately after hiring) Your main responsibilities will include, but are not limited to: 1. By manufacturing area (LIT, ETCH, DIFF, TFE…) production line monitoring of tool availibility, moves achieve rate, key stage moves achieve rate
Background Driven by strong and growing demand for power semiconductor devices, particularly in AI-related applications, improving factory productivity has become an urgent priority. We are seeking talented engineers who can contribute broadly as Device Engineering /
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen,
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring